• An automated, high-speed tamp-and-blow RFID inlay applicator with on-board pre-application RFID verification and an associated reject removal system.
• A post-application RFID verification stage, which addresses the inlays after they have been embedded within the packaging structure.
• A reject marking system linked to the post-application verification system.
• A human-machine interface to host the software controlling the various components of the system, the production database and the report generating engine.

The on-line rejection of unreadable inlays prior to their application, as well as the post-application verification, ensure minimal final package reject rates of the order of 0.1%.